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Conditions and Mechanism of Curing of some Ester-Imide Oligoiners

机译:某些酰亚胺酰亚胺低聚物的固化条件和机理

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Ester-imide oligomers obtained by melt copolycondensalion of tris(2-hydroxy-ethyl)isocianurale, ethylene glycoleopenlylglycol, diaminodiphenilmethane. trimellitic anhydride, and dimethylterephthalate were cured by heating. The curing conditions and mechanism were established by TG. Superposed TG curves of uncured and cured compounds, normalized to unity, show that curing produces an increase of heal resistance within the temperature range 250-350℃. This is assigned to the increase of chain length, supposition supported by DSC curves, which show higher glass transition temperatures for the cured materials. IR, DTA, DSC, and gas chromatography emphasized the reactions respousible for chain length increase and reaction steps. Attenuation of absorption bands of hydrroxyl or hydroxyl and methyl groups suggests that curing occurs by elimination of water and glycols. Thus, molecular weights increase about 40 times and oligomers transform into polymers.
机译:通过三(2-羟基-乙基)异氰尿酸酯,乙二醇/新戊二醇,二氨基二苯甲烷的熔融共缩聚获得的酯-酰亚胺低聚物。偏苯三酸酐和对苯二甲酸二甲酯通过加热固化。 TG确定了固化条件和机理。未固化和固化的化合物的TG曲线叠加(归一化),表明在250-350℃的温度范围内,固化会增加愈合阻力。这归因于链长的增加,假设由DSC曲线支持,这表明固化材料的玻璃化转变温度更高。 IR,DTA,DSC和气相色谱法强调了链长增加和反应步骤可重复的反应。羟基或羟基和甲基的吸收带的减弱表明固化通过消除水和二醇而发生。因此,分子量增加约40倍,并且低聚物转变成聚合物。

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