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The Role of Short Pulse High Intensity Lasers in Material Surface Properties Modification and MEMS Manufacturing

机译:短脉冲高强度激光在材料表面性能改性和MEMS制造中的作用

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High Intensity Short Pulse Lasers (HISPL's) provide high intensity ranges (I≥GW/cm2) enabling advanced not commonly developed applications in laser materials processing involving either ablation processes or shock wave thermo-mechanical treatments. Additionally, HISPL's have proven to provide especially low thermal affectation regimes in all kind of materials (especially metals) and are considered as especially suitable tools for fine Laser materials processing applications. The specificity of the interaction regimes provided by the use of these lasers has deserved intensive study on the temporal dynamics and wavelength domains in order to predict their actual effects. In most occasions, either the fast interaction through electronic populations and/or the generation of plasma origin non-conventional energy transmission modes deserving detailed analysis for the prospects of process controllability. However, in view of their exceptional properties, the use of these lasers is clearly expanding and providing new solutions for critical laser-processing applications. In the present paper, three particular applications developed at CLUPM will be reported as illustrative examples of the capabilities of this kind of devices.
机译:高强度短脉冲激光器(HISPL)提供高强度范围(I≥GW/ cm2),可在涉及烧蚀工艺或冲击波热机械处理的激光材料加工中实现先进的,尚未开发的先进应用。此外,HISPL已被证明可在所有类型的材料(尤其是金属)中提供特别低的热影响范围,并且被认为是用于精细激光材料加工应用的特别合适的工具。通过使用这些激光器提供的相互作用机制的特异性,值得对时间动态和波长域进行深入研究,以预测其实际效果。在大多数情况下,通过电子种群的快速相互作用和/或等离子体起源的非常规能量传输模式的产生,值得对过程可控性的前景进行详细分析。但是,鉴于其卓越的性能,这些激光器的使用正在明显扩展,并为关键的激光加工应用提供了新的解决方案。在本文中,将报告在CLUPM开发的三个特定应用程序作为此类设备功能的说明性示例。

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