ANTI-PLANE MOVING CRACK IN FUNCTIONALLY GRADED PIEZOELECTRIC MATERIALS

摘要

This paper considers the anti-plane moving crack in functionally graded piezoelectric materials (FGPM). The governing equations for FGPM are solved by means of Fourier cosine transform. The mathematical formulation for the permeable crack condition is derived as a system of dual integral equations. By appropriate transformations, it is shown that the dual integral equations can be reduced to a Fredholm integral equation of the second kind. The results obtained indicate that the stress intensity factor of moving crack in FGPM depends only on the mechanical loading. The gradient parameter of the FGPM and the moving velocity of the crack do have significant influence on the dynamic stress intensity factor.