Stitch-Bond-Shearing in Optoelectronic Devices, Caused by Lead-Free-Wave-Soldering- Do We Need Improved Wire-Bonding Methods?

摘要

This case study shows a typical example of a manufactur-ing-chain-rninduced reliability problem. All participants of the chainrndo their work within specifications, but, looking at the systemrnlevel, severe reliability problems have been observed. In orderrnto get back into the system-level process window, severalrncorrective actions are possible. In this case, the mostrnpromising approach is an improvement of the stitch bondrnrobustness, combined with a clear user specification.