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首页> 外文期刊>Acta Materialia >ELASTICITY STUDIES OF THE CRITICAL THICKNESS OF AN EPILAYER DEPOSITED ON A COMPLIANT SUBSTRATE
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ELASTICITY STUDIES OF THE CRITICAL THICKNESS OF AN EPILAYER DEPOSITED ON A COMPLIANT SUBSTRATE

机译:沉积在相容基质上的基盘的临界厚度的弹性研究

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摘要

The critical thickness of an epilayer on a compliant substrate with the semiconductor-on-insula- tor configuration is analytically investigated by isotropic elasticity using both superposition and Fourier transformation. The sliding boundary condition is adopted along the interface between the thin crystal sub- strate and the amorphous insulator layer where elastic constants differ from those of the crystal substrate. The critical thickness is determined from the zero formation energy of a misfit dislocation, i.e. the amount of reduced mismatch strain energy equaling the amount of created dislocation self energy. The results show that the critical thickness increases with decreases in the thickness of the thin crystal substrate and the elas- tic constant of the insulator. while Poisson's ratio has slight influences on the critical thickness.
机译:使用叠层和傅立叶变换,通过各向同性弹性分析地研究了具有绝缘体上半导体结构的柔性衬底上外延层的临界厚度。沿着薄晶体基板和非晶绝缘体层之间的界面采用滑动边界条件,其中弹性常数不同于晶体基板的弹性常数。临界厚度由错配位错的零形成能确定,即减小的错配应变能的量等于所产生的位错自身能的量。结果表明,临界厚度随着薄晶体基板厚度和绝缘体弹性常数的减小而增加。泊松比对临界厚度影响不大。

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