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首页> 外文期刊>Nuclear Instruments & Methods in Physics Research >An attempt to solve Andersen's puzzle in surface segregation during alloy sputtering
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An attempt to solve Andersen's puzzle in surface segregation during alloy sputtering

机译:解决合金溅射过程中表面偏析的安徒生难题的尝试

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The paper addresses CuPt alloy sputtering by Ar ions and discusses the well-known experiment performed by H.H. Andersen et al. 25 years ago, but not yet properly explained. The atomistic (binary-encounter) simulation has been applied to extract the concentrations of surface Cu and Ft atoms from the experimental data. The results of simulations favor segregation of Cu at all bombarding energies studied experimentally (1.25-320 keV). It has been shown that some mysterious results of the experiment can be explained by a reconstruction of the surface undergoing sputtering. For forecasting purposes, the sputtering of CuPt alloy with 0.25-1 keV Ar ions is also considered.
机译:该论文讨论了用Ar离子溅射CuPt合金的过程,并讨论了H.H. Andersen等人进行的著名实验。 25年前,但尚未正确解释。原子(二元相遇)模拟已用于从实验数据中提取表面Cu和Ft原子的浓度。模拟的结果有利于在实验研究的所有轰击能量(1.25-320 keV)下Cu的偏析。已经表明,该实验的一些神秘结果可以通过对经受溅射的表面进行重构来解释。为了进行预测,还考虑了使用0.25-1 keV Ar离子溅射CuPt合金。

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